Since its foundation in 1919, Sakuda Gold & Silver Leaf Co., Ltd. has integrated its processes from production to sales, always placing importance on quality management. For producing gold leaf, solid gold is mixed with a small amount of silver or copper, and the alloy is pounded and flattened to a thickness of 0.1~0.2μ(micron). A piece of alloy the size of a coin is flattened until it has an area of about 1.6m2. During this process, it is very important to flatten the alloy evenly. Gold leaf was pounded by craftsmen in ancient times, but now the process has been automated, and the skillful technique handed down by experienced craftsmen has been introduced into our production system to manufacture high-quality products. Our integrated production system enables us to manufacture various kinds of leaf by varying the composition of the alloy and the thickness of the gold leaf according to its intended use and the requirements of our customers.